| PART |
Description |
Maker |
| PEB22554-HT |
POT 10K OHM 9MM HORZ PLA BUSHING
|
SIEMENS AG
|
| PEEL173 |
IC,SIMPLE-EEPLD,PLA-TYPE,CMOS,DIP,24PIN,PLASTIC
|
ami
|
| 15-80-0125 0015800125 70567-0140 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.76渭m (30渭") Gold (Au) Selective Pla
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
| CX28394-22 CX28395-18 CX28395-19 CX28394 CX28395 C |
Ultraframer DS3/E3/DS2/E2/DS1/E1/DS0 DATACOM, FRAMER, PQFP128
DIODE SWITCHING DUAL ISOLATED 70V 250mA-Io 150mW 4ns-trr SOT-563 3K/REEL
POT 5K OHM 12MM VERT PLA BUSHING
DIODE SWITCH 75V 200MW SOT323
DIODE SWITCHING SINGLE 70V 250mA-Io 200mW 4ns-trr SOT-323 3K/REEL
Quad/x16/OctalT1/E1/J1 Framers
Quad/x16/Octal?T1/E1/J1 Framers
Quad/x16/Octal-T1/E1/J1 Framers
|
Conexant Systems, Inc.
|
| 0015800149 15-80-0149 A-70567-0277 |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
|
Molex Electronics Ltd.
|
| A-70567-0364 15-80-1521 |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 52 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 52 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
|
Molex Electronics Ltd.
|
| A-70567-0349 15-80-1221 0015801221 |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
|
Molex Electronics Ltd.
|
| A-70567-0343 15-80-1101 0015801101 |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
|
Molex Electronics Ltd.
|
| A-70280-0280 010-87-9805 |
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Dual Row, Vertical, High Temperature, 80 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating, Tin(Sn) PC Tail Pla
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 80 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin(Sn) PC Tail Plating, 2.72mm (.107) PC Tail
|
Molex Electronics Ltd.
|
| 47266-2001 0472662001 |
0.50mm (.020") Pitch HDMI* Receptacle, Right Angle, Black, Through Hole Shell Tab Length 1.90mm (.075"), 0.76渭m (30渭") Gold (Au) Selective Plating, Matt Tin Pla
0.50mm (.020) Pitch HDMI* Receptacle, Right Angle, Black, Through Hole Shell Tab Length 1.90mm (.075), 0.76μm (30μ) Gold (Au) Selective Plating, Matt Tin Plated Shell
|
Molex Electronics Ltd.
|
|
